Capabilities

PCB Manufacturing Capabilities

Items	Standard PCB	Advanced PCB
Manufacturing Capacity	40,000 m² per month	40,000 m²per month
Layer	1,2, 4, up to 10 layers	1,2, 4, up to 50 layers
Material	FR-4, CEM-1, Aluminum, etc.	FR-4 (Normal to high Tg), High CTI FR-4, CEM-1, CEM-3, Polymide (PI), Rogers, Glass Epoxy, Aluminium Base, Rohs Compliant, RF, etc.
PCB type	Rigid	Rigid, Flexible, Rigid-Flexible
Min. Core Thickness	4mil/0.1mm（2-12 layer）, 2mil/0.05mm (≥13layer)	4mil/0.1mm（2-12 layer）, 2mil/0.06mm (≥13layer)
Prepreg Type	1080, 2116, 765-8, 106, 3313, 2165, 1500	1080, 2116, 765-8, 106, 3313, 2165, 1500
Max Board Size	26''20.8 '' /650mm520mm	Customizable
Board Thickness	0.4mm/16mil-2.4mm/96mil	0.2mm/8mil-10.0mm/400mil
Thickness Tolerance	±0.1mm (Board Thickness<1.0mm); ±10% (Board Thickness≥1.0mm)	±0.1mm (Board Thickness<1.0mm); ±4% (Board Thickness≥1.0mm)
Dimensional deviation	±0.13mm/5.2mil	±0.10mm/4 mil
Warping Angle	0.75%	0.75%
Copper Thickness	0.5-10 oz	0.5-18 oz
Copper Thickness Tolerance	±0.25 oz	±0.25 oz
Min. Line Width/Space	4mil/0.1mm	2mil/0.05mm
Min. Drill Hole Diameter	8mil/0.2mm (mechanical)	4mil/0.1mm (laser), 6mil/0.15mm (mechanical)
PTH Wall Thickness	≥18μm	≥20μm
PTH Hole Tolerance	±3mil/0.076mm	±2mil/0.05mm
NPTH Hole Tolerance	±2mil/0.05mm	±1.5mil/0.04mm
Max. Aspect Ratio	12:1	15:1
Min. Blind/Buried Via	4mil/0.1mm	4mil/0.1mm
Surface Finish	HASL, OSP, Immersion Gold	HASL, OSP, Nickle, Immersion Gold, Imm Tin, Imm Silver, etc.
Solder Mask	Green, Red, White, Yellow, Blue, Black	Green, Red, White, Yellow, Blue, Black, Orange, Purple, etc. Customizable
Solder Mask offset	±3mil/0.076mm	±2mil/0.05mm
Silkscreen Color	Green, Red, White, Yellow, Blue, Black	Green, Blue, Black, White, Red, Purple, Transparent, Grey, Yellow, Orange, etc. Customizable
Silkscreen Min. Line Width	0.006'' or 0.15mm	0.006'' or 0.15mm
Impedance Control	±10%	±5%
Hole Location Tolerance	±0.05mm, ±0.13mm (2^nd drilled hole to 1^st hole location)	±0.05mm, ±0.13mm (2^nd drilled hole to 1^st hole location)
PCB Cutting	Shear, V-Score, Tab-routed	Shear, V-Score, Tab-routed
Tests and inspection	A.O.I., Fly Probe Testing, ET test, Microsection Inspection, Solderability Test, Impedance Test, etc.	A.O.I, Fly Probe Testing, ET test, Microsection Inspection, Solderability Test, Impedance Test, etc.
Quality Standard	IPC Class II	IPC Class II, IPC Class III
Certification	UL, ISO9001:2015, ISO14001:2015, TS16949:2009, RoHS etc.	UL, ISO9001:2008, ISO14001:2008, TS16949:2009, AS9100, RoHS, etc.

PCB Manufacturing Capabilities

Services	Turnkey-from bare boards manufacturing, Component sourcing, assembly, package, delivery; Kitted/partial turkey-partial processes of list above according to requires of customer.
Facilities	15 in-house SMT lines, 3 in-house through-hole lines, 3 in-house final assembly lines
Types	SMT, Thru-hole, Mixed (SMT/Thru-hole), Single or double sided placement
Lead Time	Quickturn, Prototype or small amount: 3-7work days days (all parts are ready). Mass Order: 7-28 work days (all parts are ready); Scheduled delivery available
Testing on Products	X-ray Inspection, ICT (In-Circuit Testing), 100% BGA X-Ray Inspection, AOI Testing (Automated Optical Inspection), Testing Jig/Mold, Functional Test, Counterfeit Component Inspection (for kitted assembly type), etc.
PCB Specifications	Rigid, Metal Core, Flexible, Flex-Rigid
Quantity	MOQ: 1 pc. Prototype, small order, mass production
Parts Procurement	Turnkey, Kitted/ Partial Turnkey
Stencials	Laser cut stainless steel
Stencials	Nano-coating available
Soldering types	Leaded, Lead-free, RoHS Compliant, No-clean and Water Clean Fluxes
Files Needed	PCB: Gerber files (CAM, PCB, PCBDOC)
	Components: Bill of Materials (BOM List)
	Assembly: Pick & Place file
PCB Panel Size	Min. Size: 0.250.25 inch (6mm6mm)
PCB Panel Size	Max Size: 4824 inch (1200mm600mm)
Components Details	Passive Down to 01005 size
	BGA and Ultra-Fine (uBGA)
	Leadless Chip Carriers/CSP
	Quad Flat Package No-Lead (QFN)
	Quad Flat Package (QFP)
	Plastic Leaded Chip Carrier (PLCC)
	SOIC
	Package-On-Package (PoP)
	Small Chip Package (Fine Pitch to 0.02mm/0.8 mils)
	Double-sided SMT Assembly
	automatic placement of Ceramic BGA, Plastic BGA, MBGA
	Removing & Replacing BGA's & MBGA's, down to 0.35mm pitch, up to 45mm
	BGA Repair and Reball
	Part Removal and Replacement
	Cable and Wire
Component package	Cut Tape, Tube, Reels, Partial Reel, Tray, Bulk, Loose Parts
Quality	IPC Class II / IPC Class III
Other Capabilities	DFM Analysis
	Aqueous Cleaning
	Conformal coating
	PCB Testing Services

Capabilities

PCB Manufacturing Capabilities

PCB Manufacturing Capabilities

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